{
  "Header": {
    "GenerationSoftware": {
      "Vendor": "KiCad",
      "Application": "Pcbnew",
      "Version": "7.0.1"
    },
    "CreationDate": "2023-05-07T16:32:39+02:00"
  },
  "GeneralSpecs": {
    "ProjectId": {
      "Name": "Alim_1000W",
      "GUID": "416c696d-5f31-4303-9030-572e6b696361",
      "Revision": "rev?"
    },
    "Size": {
      "X": 201.6,
      "Y": 180.6
    },
    "LayerNumber": 8,
    "BoardThickness": 1.6,
    "Finish": "None"
  },
  "DesignRules": [
    {
      "Layers": "Outer",
      "PadToPad": 1.0,
      "PadToTrack": 1.0,
      "TrackToTrack": 1.0,
      "MinLineWidth": 1.0
    },
    {
      "Layers": "Inner",
      "PadToPad": 1.0,
      "PadToTrack": 1.0,
      "TrackToTrack": 1.0,
      "MinLineWidth": 1.0
    }
  ],
  "FilesAttributes": [
    {
      "Path": "Alim_1000W-F_Cu.gbr",
      "FileFunction": "Copper,L1,Top",
      "FilePolarity": "Positive"
    },
    {
      "Path": "Alim_1000W-B_Cu.gbr",
      "FileFunction": "Copper,L8,Bot",
      "FilePolarity": "Positive"
    },
    {
      "Path": "Alim_1000W-F_Silkscreen.gbr",
      "FileFunction": "Legend,Top",
      "FilePolarity": "Positive"
    },
    {
      "Path": "Alim_1000W-Edge_Cuts.gbr",
      "FileFunction": "Profile",
      "FilePolarity": "Positive"
    }
  ],
  "MaterialStackup": [
    {
      "Type": "Legend",
      "Name": "Top Silk Screen"
    },
    {
      "Type": "SolderPaste",
      "Name": "Top Solder Paste"
    },
    {
      "Type": "SolderMask",
      "Thickness": 0.01,
      "Name": "Top Solder Mask"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "F.Cu"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.1,
      "Material": "FR4",
      "Name": "F.Cu/In1.Cu",
      "Notes": "Type: dielectric layer 1 (from F.Cu to In1.Cu)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "In1.Cu"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.3,
      "Material": "FR4",
      "Name": "In1.Cu/In2.Cu",
      "Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "In2.Cu"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.1,
      "Material": "FR4",
      "Name": "In2.Cu/In3.Cu",
      "Notes": "Type: dielectric layer 3 (from In2.Cu to In3.Cu)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "In3.Cu"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.3,
      "Material": "FR4",
      "Name": "In3.Cu/In4.Cu",
      "Notes": "Type: dielectric layer 4 (from In3.Cu to In4.Cu)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "In4.Cu"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.1,
      "Material": "FR4",
      "Name": "In4.Cu/In5.Cu",
      "Notes": "Type: dielectric layer 5 (from In4.Cu to In5.Cu)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "In5.Cu"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.3,
      "Material": "FR4",
      "Name": "In5.Cu/In6.Cu",
      "Notes": "Type: dielectric layer 6 (from In5.Cu to In6.Cu)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "In6.Cu"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.1,
      "Material": "FR4",
      "Name": "In6.Cu/B.Cu",
      "Notes": "Type: dielectric layer 7 (from In6.Cu to B.Cu)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "B.Cu"
    },
    {
      "Type": "SolderMask",
      "Thickness": 0.01,
      "Name": "Bottom Solder Mask"
    },
    {
      "Type": "SolderPaste",
      "Name": "Bottom Solder Paste"
    },
    {
      "Type": "Legend",
      "Name": "Bottom Silk Screen"
    }
  ]
}